Sputtering
Definition and meaning of Sputtering in chemistry.
Sputtering is a physical process where microscopic particles of a solid material are ejected from its surface after being bombarded by highly energetic ions.
In more detail
This dynamic process typically occurs inside a high-vacuum chamber where an inert gas, such as argon, is introduced and ionized to create a reactive plasma. These energetic positive ions are rapidly accelerated toward a negatively charged target material, colliding with sufficient kinetic energy to knock target atoms loose from their static lattice positions. The ejected atoms then travel freely through the vacuum environment and condense onto a secondary substrate to form a highly uniform, dense, and tightly adhering thin coating. Sputtering provides excellent control over film thickness.
Key facts
| Field | Physical Chemistry |
|---|---|
| Required Environment | High-vacuum chamber |
| Common Gas Used | Argon (Ar) |
| Primary Application | Thin film deposition |
Sputtering is routinely used to apply microscopic gold or platinum coatings to non-conductive biological samples so they can be clearly viewed under a scanning electron microscope without experiencing electrostatic charging.
Frequently asked questions
Is sputtering considered a chemical or physical change?
Sputtering is entirely a physical change because it involves the mechanical ejection of individual atoms without permanently altering their underlying chemical identity.